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PhD position (m/f/d) for High Frequency Design for Wafer-Level Packaging
Frankfurt an der Oder
Aktualität: 22.11.2021

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22.11.2021, IHP GmbH - Institut für innovative Mikroelektronik
Frankfurt an der Oder
PhD position (m/f/d) for High Frequency Design for Wafer-Level Packaging
Within the doctorate with the working title «Development and evaluation of advanced wafer-level packaging components and technologies for mm-wave and THz applications», it is intended to develop concepts and components for multifunctional high frequency packaging platforms including Fan-Out Wafer-level Packaging (FOWLP) and 3D heterogeneous integration. The doctorate is supported by an experienced supervisor and accompanied within the framework of a supervision agreement. We aim together for a completion within 3-5 years. After one and a half years, the topic will be finally defined and the contract duration will be adjusted accordingly by mutual agreement to the foreseeable doctoral period.
You are holding a Master's degree in Electrical Engineering, Information and Communication Technology, Physics or a comparable study area. You are already experienced in the design and characterization of high frequency components using ANSYS HFSS 3D EM simulator, IC layout (Cadence, Keysight ADS, TexEDA), and data analysis (Matlab, Python, Origin). Ideally, you have a background in semiconductor technologies, printed circuit board technology as well as assembly technologies. You are also a strong team player. We are looking for a team member, who is able to structure his or her own work and to bring a well-organized and systematic way of working into the cooperation with creative minds. You are an ideal match for this position, when you have experimental, analytical and problem-solving skills, very strong communicative skills and the ability to quickly learn how to operate the latest technical equipment including various software. It is necessary that you confidently handle the English language. Very good German skills are needed. The deepening of English language skills is expected and highly encouraged, for example in in-house language courses and intensive courses.

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PhD position (m­­/­­f­­/­­d) for High Frequency Design for Wafer-Level Packaging

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Frankfurt an der Oder