Development Engineer Waferbond and Laser Lift Off Processes (m/f/d)

93047 Regensburg
28.12.2020

Daten dieser Anzeige

Job-ID: 019254905
Development Engineer Waferbond and Laser Lift Off Processes (m/f/d)

OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung

Germany

https://osram-gmbh.contactrh.com/jobs/4348/34282695/en_US

Autonomous planning, execution and evaluation of experiments covering wafer-to-wafer bonding and/or laser lift off processes within the frame of running product projects Development of novel frontend processes from scratch to production readiness in the area of adhesive and/or metallic waferbonding and/or laser lift off, including tool concepts, tool specification & procurement, tool & process setup and process stabilization & transfer to production Exchange with others within the project and process network, especially project leader(s), key experts and counterparts in production

Create light to improve life OSRAM is a leading global high-tech company that utilizes the infinite possibilities of light to improve the quality of life for individuals and communities. Our innovations will enable people all over the world not only to see better, but also to communicate, travel, work, and live better. Primarily focused on semiconductor-based technologies, our products are used in highly diverse applications ranging from virtual reality to autonomous driving and from smartphones to networked, intelligent lighting solutions in buildings and cities. The business unit Opto Semiconductors (OS) forms the technological backbone of OSRAM and has been one of the world's leading manufacturers of optoelectronic components for many years. OS is a leader in special applications such as infrared components for smartphones or autonomous driving. Your new responsibilities

Forschung & Entwicklung

Elektronik/ Elektrotechnik/ Feinmechanik

Angestellter/ Fachkraft

Vollzeit

93047 Regensburg